1318714-1 datasheet

Маркировка

1318714-1
Производитель

TE Connectivity
Описание

TE Connectivity 1318714-1 Applies To: Printed Circuit Board Assembly Process Feature: None Backshell Plating: Matte Tin Contact Plating, Mating Area, Material: Gold Contact Plating, Mating Area, Thickness (?µm [??in]): 0.1 [3.937] Contact Termination Type: Through Hole Front Shell Plating: Matte Tin over Nickel Gender: Receptacle Housing Color: Black Lead Free Solder Processes: Wave solder capable to 240?°C, Wave solder capable to 260?°C, Wave solder capable to 265?°C Locating Post(s): With Mount Location: Top Number Of Ports: 1 Number Of Positions: 4 Orientation: Vertical Packaging Method: Tray Panel Ground: With Panel Ground Location: Top Panel Ground Type: M1.6 Threaded Hole Pcb Mount Retention Type: Straight Leg Pcb Thickness (minimum) (mm [in]): 0.80 [0.031] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Converted to comply with RoHS directive Series: IEEE 1394a Size: Mini Tail Length (mm [in]): 2 [0.079] Termination Method: Solder
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1 шт.
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53,53 KB